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  the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos field effect transistor 2sK3642 switching n-channel power mos fet data sheet document no. d15970ej4v0ds00 (4th edition) date published january 2005 ns cp(k) printed in japan 2002 the mark shows ma j or revised p oints. ordering information part number package 2sK3642-zk to-252 (mp-3zk) description the 2sK3642 is n-channel mos fe t device that features a low on-state resistance and excellent switching characteristics, and designed for low voltage high current applications such as dc/dc converter with synchronous rectifier. features ? low on-state resistance r ds(on)1 = 9.5 m ? max. (v gs = 10 v, i d = 32 a) r ds(on)2 = 16 m ? max. (v gs = 4.5 v, i d = 18 a) ? low c iss : c iss = 1100 pf typ. ? built-in gate protection diode absolute maximum ratings (t a = 25c) drain to source voltage (v gs = 0 v) v dss 30 v gate to source voltage (v ds = 0 v) v gss 20 v drain current (dc) (t c = 25c) i d(dc) 64 a drain current (pulse) note1 i d(pulse) 190 a total power dissipation (t c = 25c) p t1 36 w total power dissipation p t2 1.0 w channel temperature t ch 150 c storage temperature t stg ?55 to + 150 c single avalanche current note2 i as 25 a single avalanche energy note2 e as 62 mj notes 1. pw 10 s, duty cycle 1% 2. starting t ch = 25c, v dd = 15 v, r g = 25 ? , l = 100 h, v gs = 20 0 v (to-252)
data sheet d15970ej4v0ds 2 2sK3642 electrical characteristics (t a = 25c) characteristics symbol test conditions min. typ. max. unit zero gate voltage drain current i dss v ds = 30 v, v gs = 0 v 10 a gate leakage current i gss v gs = 20 v, v ds = 0 v 10 a gate cut-off voltage v gs(off) v ds = 10 v, i d = 1 ma 1.5 2.5 v forward transfer admittance note | y fs | v ds = 10 v, i d = 32 a 13 26 s drain to source on-state resistance note r ds(on)1 v gs = 10 v, i d = 32 a 7.6 9.5 m ? r ds(on)2 v gs = 4.5 v, i d = 18 a 10.8 16 m ? input capacitance c iss 1100 pf output capacitance c oss 410 pf reverse transfer capacitance c rss v ds = 10 v v gs = 0 v f = 1 mhz 150 pf turn-on delay time t d(on) 9.6 ns rise time t r 5.1 ns turn-off delay time t d(off) 38 ns fall time t f v dd = 15 v, i d = 32 a v gs = 10 v r g = 10 ? 10 ns total gate charge q g 23 nc gate to source charge q gs 4.3 nc gate to drain charge q gd v dd = 24 v v gs = 10 v i d = 64 a 6 nc body diode forward voltage note v f(s-d) i f = 64 a, v gs = 0 v 1.0 v reverse recovery time t rr i f = 64 a, v gs = 0 v 31 ns reverse recovery charge q rr di/dt = 100 a/ s 25 nc note pulsed: pw 350 s, duty cycle 2% test circuit 3 gate charge v gs = 20 0 v pg. r g = 25 ? 50 ? d.u.t. l v dd test circuit 1 avalanche capability pg. d.u.t. r l v dd test circuit 2 switching time r g pg. i g = 2 ma 50 ? d.u.t. r l v dd i d v dd i as v ds bv dss starting t ch v gs 0 = 1 s duty cycle 1% v gs wave form v ds wave form v gs v ds 10% 0 0 90% 90% 90% v gs v ds t on t off t d(on) t r t d(off) t f 10% 10%
data sheet d15970ej4v0ds 3 2sK3642 typical characteristics (t a = 25 c) derating factor of forward bias safe operating area total power dissipation vs. case temperature dt - percentage of rated power - % 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 t c - case temperature - c p t - total power dissipation - w 0 10 20 30 40 50 0 25 50 75 100 125 150 175 t c - case temperature - c forward bias safe operating area i d - drain current - a 0.1 1 10 100 1000 0.1 1 10 100 i d(pulse) t c = 25 c single pulse 10 ms power dissipation limited i d(dc) pw = 100 s 10 s 1 ms dc r ds(on) lim ited (at v gs = 10 v) v ds - drain to source voltage - v transient thermal resistance vs. pulse width r th(t) - transient thermal resistance - c/w 0.01 0.1 1 10 100 1000 single pulse r th(ch-a) = 125 c/w r th(ch-c) = 3.47 c/w pw - pulse width - s 10 100 1 m 10 m 100 m 1 10 100 1000
data sheet d15970ej4v0ds 4 2sK3642 drain current vs. drain to source voltage forward transfer characteristics i d - drain current - a 0 50 100 150 200 250 0123 v gs = 10 v pulsed 4.5 v v ds - drain to source voltage - v i d - drain current - a 0.01 0.1 1 10 100 1000 012345 t ch = ? 55 c 25 c 75 c 150 c v ds = 10 v pulsed v gs - gate to source voltage - v gate cut-off voltage vs. channel temperature forward transfer admittance vs. drain current v gs(off) - gate cut-off voltage - v 0 0.5 1 1.5 2 2.5 3 -50 0 50 100 150 v ds = 10 v i d = 1 ma t ch - channel temperature - c | y fs | - forward transfer admittance - s 0.1 1 10 100 0.1 1 10 100 t ch = ? 55 c 25 c 75 c 150 c v ds = 10 v pulsed i d - drain current - a drain to source on-state resistance vs. drain current drain to source on-state resistance vs. gate to source voltage r ds(on) - drain to source on-state resistance - m ? . ? 0 5 10 15 20 25 30 0 5 10 15 20 i d = 32 a pulsed v gs - gate to source voltage - v
data sheet d15970ej4v0ds 5 2sK3642 drain to source on-state resistance vs. channel temperature capacitance vs. drain to source voltage r ds(on) - drain to source on-state resistance - m ? . . . . ? i d - drain current - a v ds - drain to source voltage - v 0 5 10 15 20 25 30 0 5 10 15 20 25 0 2 4 6 8 10 12 v ds v dd = 24 v 15 v i d = 64 a v gs q g - gate charge - nc v gs - gate to source voltage - v source to drain diode forward voltage reverse recovery time vs. diode forward current i f - diode forward current - a 0.01 0.1 1 10 100 1000 00.511.5 v gs = 10 v 0 v pulsed v f(s-d) - source to drain voltage - v t rr - reverse recovery time - ns 1 10 100 1000 0.1 1 10 100 di/dt = 100 a/ s v gs = 0 v i f - diode forward current - a
data sheet d15970ej4v0ds 6 2sK3642 single avalanche current vs. inductive load single avalanche energy derating factor i as - single avalanche current - a 0.1 1 10 100 0.01 0.1 1 10 e as = 62 mj i as = 25 a v dd = 15 v v gs = 20 0 v r g = 25 ? starting t ch = 25 c l - inductive load - mh energy derating factor - % 0 20 40 60 80 100 120 25 50 75 100 125 150 v dd = 15 v v gs = 20 0 v r g = 25 ? i as 25 a starting t ch - starting channel temperature - c
data sheet d15970ej4v0ds 7 2sK3642 package drawing (unit: mm) to-252 (mp-3zk) 6.5 0.2 2.3 0.1 0.5 0.1 0.76 0.12 0 to 0.25 0.5 0.1 1.0 no plating no plating 5.1 typ. 1.0 typ. 6.1 0.2 0.51 min. 4.0 min . 0.8 10.4 max. (9.8 typ.) 4.3 min. 1 4 23 1.14 max. 2.3 2.3 1. gate 2. drain 3. source 4. fin (drain) equivalent circuit remark the diode connected between t he gate and source of the transistor serves as a protector against esd. when this device actually used, an additional protection circuit is ex ternally required if a voltage exceeding the rated voltage ma y be applied to this device. source body diode gate protection diode gate drain
2sK3642 the information in this document is current as of january, 2005. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1


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